eAPUS Technology, Inc.eAPUS Technology, Inc.

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Silicone Gap Filler ▎HS300Silicone Gap Filler ▎HS300

Silicone Gap Filler  ▎HS300
  • Brand

    TOP PAD
  • Color

    blue
  • Thermal conductivity

    3
  • Thermal resistance

    0.32 ~ 1.9 ℃in²/W @ 30psi
  • Volume resistivity

    10^14 Ωm
  • Breakdown voltage

    8.6 KV/mm
  • Withstand voltage

    8 KV/mm
  • Thickness

    0.3 ~ 5.5 mm
  • Hardness

    40 (Shore 00)
  • Specific gravity

    2.8
  • Operating temperature

    -40 ℃ ~ +180 ℃
  • Total mass loss

    0.09 %
  • Features

    • Low oil-bleeding
    • Highly compressible
    • Single-sided self-tacky
    • Reworkable
    • Low oil bleeding

    • Highly compressible

    • Single-sided self-tacky

    • Reworkable

    • Environmental friendly

    • UL

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