eAPUS Technology, Inc.

Silicone Gap Filler_ HS300

• Brand

  TOP PAD

• Color

  blue

• Thermal conductivity

  3

• Thermal resistance

  0.32 ~ 1.9 ℃in²/W @ 30psi

• Volume resistivity

  10^14 Ωm

• Breakdown voltage

  8.6 KV/mm

• Withstand voltage

  8 KV/mm

• Thickness

  0.3 ~ 5.5 mm

• Hardness

  40 (Shore 00)

• Specific gravity

  2.8

• Operating temperature

  -40 ℃ ~ +180 ℃

• Total mass loss

  0.09 %

• Features

  • Low oil-bleeding
  • Highly compressible
  • Single-sided self-tacky
  • Reworkable

  • 

    Low oil bleeding

  • 

    Highly compressible

  • 

    Single-sided self-tacky

  • 

    Reworkable

  • 

    Environmental friendly

  • 

    UL