eAPUS Technology, Inc.eAPUS Technology, Inc.

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Silicone Gap Filler_ HS500Silicone Gap Filler_ HS500

Silicone Gap Filler_ HS500
  • Brand

    TOP PAD
  • Color

    green
  • Thermal conductivity

    5
  • Thermal resistance

    0.17 ~ 0.8 ℃in²/W @ 30psi
  • Volume resistivity

    10^14 Ωm
  • Dielectric strength

    8.7 KV/mm
  • Withstand voltage

    8 KV/mm
  • Thickness

    0.5 ~ 3 mm
  • Hardness

    52 (Shore 00)
  • Specific gravity

    3.3
  • Operating temperature

    -40 ℃ ~ +180 ℃
  • Features

    • Highly compressible.
    • Single-sided self-tacky.
    • Good reworkability.
    • Highly compressible

    • Single-sided self-tacky

    • Reworkable

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